Miorex
(manufactured by Ryodenkasei Co., Ltd.)
Miorex is widely known as an insulating material due to its excellent thermal insulation, mechanical strength, and electrical insulation. It is highly heat resistant and does not contain asbestos, so it is safe, and is less expensive than ceramics, making it cost-effective. Its
high thermal insulation reduces heat dissipation, resulting in significant energy savings.
It stabilizes the temperature distribution of the mold and reduces heat conduction to the molding machine body, thereby extending the life of the mold and molding machine.
On the other hand, it is brittle and prone to chipping and peeling during processing, which causes rapid wear of the cutting tool when cutting.
It is a material that requires careful handling during processing, and is classified as expensive to process.
We have experience processing mainly PMX-561, PMX-562, PMX-573, PGX-595, etc. Please contact us for details.
Miorex Series
PMX-573
This grade combines heat resistance with economical efficiency.
PMX-561
This versatile grade combines high heat resistance and economical efficiency, and can be used for a wide range of applications.
This product number is the main item we stock.
We also carry PMX-562, which is a material that meets the Food Sanitation Act.
PGX-595
Within the series, this is the most reliable grade with excellent heat resistance, mechanical strength, and dimensional stability.
PMX-562
This material is used in bread machines and bakery ovens, etc., and is of a grade that meets the standards for ceramic utensils under the Food Sanitation Act.
Specification table
*Please scroll horizontally to view.
| Units/Conditions | PGX-595 | PMX-573 | PMX-561 | |
|---|---|---|---|---|
| Heat resistance | ℃ (Heat resistance temperature) | 400 | 250 | 500 |
| Bending strength (perpendicular to layers) | MPa (perpendicular to layer, length direction of substrate) | 130-145 | 100-150 | 45-55 |
| MPa (perpendicular to layer, width direction of substrate) | 120-130 | – | – | |
| Compressive strength (perpendicular to layers) | MPa | 420-480 | 150-200 | 120-150 |
| Compressive strength (parallel to layers) | MPa | 45-70 | – | – |
| Izod impact strength | J/cm (parallel to layer, width direction of substrate) | 1.5-2.5 | – | – |
| Charpy impact strength | J/cm2 (perpendicular to layer) | 2.5 | 1.5 | 1.1 |
| Cleavage strength | kN | 2.0-3.0 | – | – |
| Water absorption rate | % (after 24 hours of immersion in water) | 0.1 | 2.0-5.0 | 4.0-6.0 |
| Thermal Conductivity | W/m.k | 0.3 | 0.3 | 0.3 |
| Coefficient of thermal expansion (perpendicular to layers) | 1/℃ | 2.3X10-5 | 6.6X10-6 | 9.0X10-6 |
| Specific gravity | J/(g･K) | 2.0-2.1 | 2.0-2.2 | 2.0-2.2 |
| Through-layer breakdown voltage | MV/m | 10-20 | – | – |
| Volume resistivity | Ω-cm 4hr/150℃ after drying | 1015 | 1012 | 1014 |
| Ωｰcm 100hr/25℃ 90% moisture | 1013 | 107 | 109 |
- *The characteristics in the specification table are standard characteristics and not guaranteed performance.
Application example
- Heating furnace
- Molding machine
- Semiconductor manufacturing equipment, etc.
