Paper Bakelite is one of the engineering plastics, and is classified as a thermosetting resin.
It is a laminated board with paper as the base material and hardened with phenolic resin. It is a versatile insulating material, inexpensive, and easy to machine.
Taking advantage of its mechanical strength, heat resistance, and electrical insulation properties, it is widely used in fields such as semiconductors and insulating materials.
If the purpose is electrical insulation, we recommend paper bakelite, and if the purpose is impact resistance, we recommend cloth bakelite.
It is a cheaper material compared to cloth.
FL-102 is a paper-based phenolic resin laminate that has excellent heat resistance, abrasion resistance, insulation, and chemical resistance. It is easy to process and is widely used in the manufacture of machine parts and electrical equipment. It complies with the Food Sanitation Act and the revised Food Sanitation Act.
It has excellent electrical properties such as withstand voltage and is easy to process. It is a high-voltage product that is a higher grade than PL-PEM.
This is the most standard laminate used in electrical and electronic equipment parts, and is highly easy to process.
*Please scroll horizontally to view.
Material Type | Paper-based phenolic resin | |||||
---|---|---|---|---|---|---|
JIS standard | PL-PEM | |||||
ANSI standard | (XX) | |||||
UL standard | 94 H B | |||||
Part number | FL-102 | |||||
Through-layer voltage resistance | in oil | MV/m | C-90/20/65 | No destruction 15OK(13OK) | ||
Layer withstand voltage | in hot oil | kV | C-90/20/65 +D-2/100 |
No destruction 9OK(8OK) | ||
Insulation resistance | normal condition | MΩ | C-90/20/65 | 5×10³-10⁶(5×10²) | ||
after boiling | C-90/20/65 +D-2/100 |
3×10-5×10²(10) | ||||
Volume Resistivity | normal condition | MΩ-cm | C-90/20/65 | 10⁵-10⁷ | ||
after moisture absorption treatment | C-90/20/65 +C-96/40/90 |
10⁴-10⁶ | ||||
Surface resistance | normal condition | MΩ | C-90/20/65 | 10⁵-10⁷ | ||
after moisture absorption treatment | C-90/20/65 +C-96/40/90 |
10⁴-10⁶ | ||||
Dielectric constant | normal condition | – | C-90/20/65 | 4.0-6.0 | ||
after water immersion | C-90/20/65 +D-24/23 |
4.5-6.5 | ||||
Dielectric loss tangent | normal condition | – | C-90/20/65 | 0.030-0.050 | ||
after water immersion | C-90/20/65 +D-24/23 |
0.035–0.055 | ||||
Bending strength | Perpendicular to layer | LW | MPa | A | 120-200(98) | |
CW | 110-180(98) | |||||
Izod | Parallel to layer | J/cm | A | 0.21–0.40(0.20) | ||
Cleavage strength | kN | A | 3.9-6.4(3.4) | |||
Water absorption rate | % | E-24/50 +D-24/23 |
3.0mm | 0.60-0.80(1.30) | ||
10.0mm | 0.20-0.35(0.55) | |||||
Appearance after heating | Heat for 2 hours | – | A | 130℃ No abnormalities (130℃±2) | ||
Specific gravity | – | A | 1.31-1.35(1.25-1.50) | |||
Acetone resistant (boiled for 30 minutes) | – | A | No abnormalities | |||
Rockwell Hardness | M scale | – | A | 110±10 |
*Please scroll horizontally to view.
Material Type | Paper-based phenolic resin | |||||
---|---|---|---|---|---|---|
JIS standard | PL-PEV | |||||
ANSI standard | (XXX) | |||||
UL standard | 94 H B | |||||
Part number | FL-100 | |||||
Through-layer voltage resistance | in oil | MV/m | C-90/20/65 | No destruction 18OK(16OK) | ||
Layer withstand voltage | in hot oil | kV | C-90/20/65 +D-2/100 |
No destruction 10OK(8OK) | ||
Insulation resistance | normal condition | MΩ | C-90/20/65 | 10⁴-10⁶(5×10³) | ||
after boiling | C-90/20/65 +D-2/100 |
5×10-5×10³(50) | ||||
Volume Resistivity | normal condition | MΩ-cm | C-90/20/65 | 10⁵-10⁷ | ||
after moisture absorption treatment | C-90/20/65 +C-96/40/90 |
10⁴-10⁶ | ||||
Surface resistance | normal condition | MΩ | C-90/20/65 | 10⁵-10⁷ | ||
after moisture absorption treatment | C-90/20/65 +C-96/40/90 |
10³-10⁵ | ||||
Dielectric constant | normal condition | – | C-90/20/65 | 4.5-6.5 | ||
after water immersion | C-90/20/65 +D-24/23 |
5.0-7.0 | ||||
Dielectric loss tangent | normal condition | – | C-90/20/65 | 0.030-0.050 | ||
after water immersion | C-90/20/65 +D-24/23 |
0.040-0.060 | ||||
Bending strength | Perpendicular to layer | LW | MPa | A | 108-167(88) | |
CW | 98-137(88) | |||||
Izod | Parallel to layer | J/cm | A | 0.20-0.35(0.15) | ||
Cleavage strength | kN | A | 4.4-6.9(2.9) | |||
Water absorption rate | % | E-24/50 +D-24/23 |
10.0mm | 0.28-0.33(0.45) | ||
Appearance after heating | Heat for 2 hours | – | A | 130℃ No abnormalities (130℃±2) | ||
Specific gravity | – | A | 1.33-1.38(1.25-1.50) | |||
Acetone resistant (boiled for 30 minutes) | – | A | No abnormalities | |||
Rockwell Hardness | M scale | – | A | 105-120 |
*Please scroll horizontally to view.
Part number | PCP-463 | |||||
---|---|---|---|---|---|---|
Appearance color | Primary colors | |||||
Substrate and Resin | String and thread cloth Phenol | |||||
Through-layer breakdown voltage | MV/m | C-90/20/65 | 11-15 | |||
Linear Breakdown Voltage | kV/6mm | O-0.5/90 | 8-15 | |||
Insulation resistance | MΩ | C-90/20/65 | 103-105 | |||
C-90/20/65 D-2/100 |
5×101-102 | |||||
Dielectric constant | – | C-90/20/65 (1MHz) |
5.5-7.0 | |||
Dielectric loss tangent | – | C-90/20/65 (1MHz) |
0.08-0.10 | |||
Bending strength | MPa | A,FW-LW | 140-180 | |||
A,FW-CW | 90-140 | |||||
Tensile strength | MPa | A,LW | 70~100 | |||
A,CW | 50-80 | |||||
Compressive strength | MPa | A,FW | 260-330 | |||
A,EW | 180-230 | |||||
Impact strength (Izod) | J/cm | A,EW-CW | 0.8-1.3 | |||
Impact strength (Charby) | J/cm² | A,FW | – | |||
Cleavage strength | kN | A | 9.0-12.0 | |||
Appearance after heating | ℃ | 2hr | 140 | |||
Specific gravity | – | A | 1.30-1.40 | |||
Compressive creep properties | % | 180℃-10MPa (200hr) |
– | |||
Thermal expansion coefficient | 1/℃ | A,FW | – | |||
Thermal Conductivity | W/(m K) | A,FW | – | |||
Young’s modulus (tensile modulus of elasticity) | GPa | LW | – | |||
Compressive modulus | GPa | FW | – | |||
Poisson’s ratio | – | – | – | |||
Specific heat | J/(g K) | – | – | |||
Reference standard | JIS K 6912 | PL-FLE | ||||
NEMA | LE | |||||
MIL | FBE |